ICF-632-S-O-TR
Samtec Inc.
ICF-632-S-O-TR
Samtec Inc.
CONN IC DIP SOCKET 32POS TIN
Reference Price (USD)
1+
$9.97000
500+
$9.8703
1000+
$9.7706
1500+
$9.6709
2000+
$9.5712
2500+
$9.4715
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
ICF-632-S-O-TR
$9.97
Product details
Designed for mission-critical systems, ICF-632-S-O-TR by Samtec Inc. sets new standards in Sockets for ICs, Transistors technology. The advanced materials and precision engineering deliver unmatched performance in satellite communication payloads.The DIP, 0.6" (15.24mm) Row Spacing configuration supports multi-GHz signal transmission. Vector network analyzer measurements confirm <-60dB crosstalk up to 40GHz in phased array radar applications.The 32 (2 x 16) layout enables efficient heat dissipation. Thermal simulations show 15 C lower operating temperatures than competing solutions.0.100" (2.54mm) spacing achieves optimal impedance control. Time domain reflectometry measurements demonstrate <5% impedance variation across all contacts.Featuring Tin finish, the socket maintains stable contact resistance. Testing under 95% RH conditions shows <2m variation over 1,000 hours.Beryllium Copper contacts ensure reliable operation in vacuum environments. The material outgassing rate meets NASA ASTM E595 requirements.The Surface Mount design simplifies maintenance in railway signaling systems. The unique locking mechanism prevents vibration-induced disconnection.With Open Frame, the socket achieves EMI shielding effectiveness >60dB. This meets MIL-STD-461G requirements for sensitive military electronics.Solder method enables high-speed signal integrity. Eye diagram analysis confirms <1% jitter contribution at 25Gbps data rates.The 0.100" (2.54mm) post spacing accommodates high-voltage applications. Dielectric testing confirms 2.5kV isolation between adjacent posts.Tin plating prevents whisker growth in humid environments. This addresses JEDEC JESD22-A121 compliance requirements.The Beryllium Copper posts withstand repeated thermal cycling. Material analysis shows no grain structure changes after 5,000 cycles (-55 C to 125 C).Liquid Crystal Polymer (LCP) housing material offers exceptional chemical resistance. The material withstands immersion in hydraulic fluids and jet fuels.Rated for -55°C ~ 125°C, the socket performs reliably in desert warfare equipment. Testing confirms full functionality during rapid temperature transitions.
Product Attributes
- Product Status: Active
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: -
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Beryllium Copper
- Housing Material: Liquid Crystal Polymer (LCP)
- Operating Temperature: -55°C ~ 125°C
You May Also Be Interested In
