IBM25PPC750GLECR5HB3T
IBM
IBM25PPC750GLECR5HB3T
IBM
POWERPC 750GL RISC MPU
Reference Price (USD)
1+
$73.20000
500+
$72.468
1000+
$71.736
1500+
$71.004
2000+
$70.272
2500+
$69.54
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
IBM25PPC750GLECR5HB3T
$73.20
Product details
IBM's IBM25PPC750GLECR5HB3T revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC 750GL core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 933MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.No graphics capabilities enable visualization of network performance metrics in real-time.1.8V, 2.5V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for -40°C ~ 105°C (TJ) operation, the processor maintains performance in outdoor radio unit installations.The 292-BCBGA Exposed Pad package design optimizes thermal performance for continuous high-load operation.Available in 292-CBGA (21x21), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC 750GL
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 933MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TJ)
- Security Features: -
- Package / Case: 292-BCBGA Exposed Pad
- Supplier Device Package: 292-CBGA (21x21)
You May Also Be Interested In