HSS14-B20-NP
CUI Devices
HSS14-B20-NP
CUI Devices
HEAT SINK, STAMPING, TO-220, 19.
Reference Price (USD)
1+
$0.54015
500+
$0.5347485
1000+
$0.529347
1500+
$0.5239455
2000+
$0.518544
2500+
$0.5131425
Exquisite packaging
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HSS14-B20-NP
$0.54
Product details
The HSS14-B20-NP from CUI Devices sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 0.980" (24.89mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 0.750" (19.05mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.157" (4.00mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.Rated for 3.1W @ 75°C in portable device environments, the design includes skin temperature limits for user comfort. Thermal models account for pocket-use scenarios.The 11.60°C/W @ 200 LFM performance is optimized for low-speed fans (<5 CFM). The design maintains acoustic levels below 25dBA in typical usage scenarios.The 23.91°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.Black PVD coating ensures aesthetic consistency with consumer electronics while improving radiative cooling. The finish meets MIL-STD-810G abrasion resistance requirements.
Product Attributes
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: -
- Shape: Rectangular
- Length: 0.980" (24.89mm)
- Width: 0.750" (19.05mm)
- Diameter: -
- Fin Height: 0.157" (4.00mm)
- Power Dissipation @ Temperature Rise: 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 11.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 23.91°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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