HSIB918-A
iBASE Technology
HSIB918-A
iBASE Technology
AC, HEATSINK + FAN FOR IB918 SER
Reference Price (USD)
1+
$53.87000
500+
$53.3313
1000+
$52.7926
1500+
$52.2539
2000+
$51.7152
2500+
$51.1765
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSIB918-A
$53.87
Product details
The HSIB918-A from iBASE Technology represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IB918
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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