HSIB915-BGA-B
iBASE Technology
HSIB915-BGA-B
iBASE Technology
AC, HEATSINK FOR IB915 SERIES, (
Reference Price (USD)
1+
$37.04000
500+
$36.6696
1000+
$36.2992
1500+
$35.9288
2000+
$35.5584
2500+
$35.188
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSIB915-BGA-B
$37.04
Product details
The HSIB915-BGA-B from iBASE Technology represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IB915
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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