HSIB899-BGA-A
iBASE Technology
HSIB899-BGA-A
iBASE Technology
AC, HEATSINK FOR IB899 SERIES, (
Reference Price (USD)
1+
$38.72000
500+
$38.3328
1000+
$37.9456
1500+
$37.5584
2000+
$37.1712
2500+
$36.784
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSIB899-BGA-A
$38.72
Product details
Optimized for automotive electronics, the HSIB899-BGA-A by iBASE Technology sets new standards in Thermal - Heat Sinks reliability. This AEC-Q200 qualified thermal solution addresses unique challenges in electric vehicle power systems, combining robust construction with exceptional thermal performance.The Top Mount Skived design provides precise flatness ( 0.05mm/m ) required for automotive power modules. The manufacturing process eliminates internal stresses that could lead to micro-cracking in vibration environments.Specifically engineered for IGBT and TE0600 packages, the solution manages {Power Dissipation @ Temperature Rise} under hood temperatures reaching 125 C. The thermal interface maintains integrity across 1000+ thermal shock cycles (-40 C to +150 C).
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IB899
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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