HSIB898-BGA-A
iBASE Technology
HSIB898-BGA-A
iBASE Technology
AC, HEATSINK FOR IB898, (ROHS) ,
Reference Price (USD)
1+
$26.94000
500+
$26.6706
1000+
$26.4012
1500+
$26.1318
2000+
$25.8624
2500+
$25.593
Exquisite packaging
Discount
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HSIB898-BGA-A
$26.94
Product details
iBASE Technology's HSIB898-BGA-A delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IB898
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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