HSIB897-BGA
iBASE Technology
HSIB897-BGA
iBASE Technology
AC, HEATSINK FOR IB897, (ROHS),
Reference Price (USD)
1+
$37.04000
500+
$36.6696
1000+
$36.2992
1500+
$35.9288
2000+
$35.5584
2500+
$35.188
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSIB897-BGA
$37.04
Product details
iBASE Technology's HSIB897-BGA offers military-grade thermal solutions in the Thermal - Heat Sinks segment, specifically developed for aerospace and defense applications. This ruggedized design exceeds stringent military specifications while delivering exceptional thermal performance in extreme environments.The Board Level Vertical Extrusion configuration withstands 15g vibration per MIL-STD-810H. Unlike commercial designs, this variant maintains thermal contact under combined thermal and mechanical stress.Engineered for power modules in radar and avionics systems, the solution manages {Power Dissipation @ Temperature Rise} at 50,000ft altitude. The thermal interface maintains performance across -55 C to +125 C operational range.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: IB897
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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