HSIB822-1
iBASE Technology
HSIB822-1
iBASE Technology
AC, HEAT SPREADER FOR IB822, (RO
Reference Price (USD)
1+
$26.94000
500+
$26.6706
1000+
$26.4012
1500+
$26.1318
2000+
$25.8624
2500+
$25.593
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSIB822-1
$26.94
Product details
The HSIB822-1 from iBASE Technology represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.
Product Attributes
- Product Status: Active
- Type: Heat Spreader
- Package Cooled: IB822
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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