HSET950-BGA-1
iBASE Technology
HSET950-BGA-1
iBASE Technology
HEATSINK WITH COOLER FOR ET950 &
Reference Price (USD)
1+
$33.67000
500+
$33.3333
1000+
$32.9966
1500+
$32.6599
2000+
$32.3232
2500+
$31.9865
Exquisite packaging
Discount
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HSET950-BGA-1
$33.67
Product details
The HSET950-BGA-1 from iBASE Technology sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: ET950, ET960
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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