HSET860-BGA-1
iBASE Technology
HSET860-BGA-1
iBASE Technology
HEATSINK FOR ET860(H051HSET860B0
Reference Price (USD)
1+
$16.84000
500+
$16.6716
1000+
$16.5032
1500+
$16.3348
2000+
$16.1664
2500+
$15.998
Exquisite packaging
Discount
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HSET860-BGA-1
$16.84
Product details
The HSET860-BGA-1 from iBASE Technology sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: ET860
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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