HSEC8-130-01-L-DV-A-K
Samtec Inc.
HSEC8-130-01-L-DV-A-K
Samtec Inc.
CONN EDGE DUAL FMALE 60POS 0.031
Reference Price (USD)
1+
$6.54000
500+
$6.4746
1000+
$6.4092
1500+
$6.3438
2000+
$6.2784
2500+
$6.213
Exquisite packaging
Discount
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HSEC8-130-01-L-DV-A-K
$6.54
Product details
Samtec Inc.'s HSEC8-130-01-L-DV-A-K delivers breakthrough performance in Card Edge Connectors - Edgeboard Connectors for industrial IoT edge devices. Optimized for Industry 4.0 applications, this connector combines robust construction with smart connectivity features.Supporting Non Specified - Dual Edge standards, the design features protocol-agnostic interfaces. The universal contact arrangement accommodates 15+ industrial fieldbus protocols without hardware changes.The Female configuration includes smart latching. The electronic interlock provides digital mating confirmation to the host controller via IO-Link interface.With 30 contacts per row, the layout supports hybrid power+data. The integrated power contacts deliver 10A alongside 1Gbps Ethernet signals.The 60 contact array enables edge computing. The arrangement provides 32 GPIO channels plus 4 differential pairs for sensor aggregation.Compatible with 0.062" (1.57mm) industrial PCBs, the connector features vibration-resistant contacts. The dual-spring design maintains connection through 10G random vibration.The 2 row architecture includes surge protection. Each I/O line incorporates 1.5kV TVS diodes for overvoltage protection in harsh electrical environments.The 0.031" (0.80mm) pitch design enables IP69K sealing. The overmolded gasket geometry prevents water ingress at 100bar pressure washing.Dual capability provides condition monitoring. Integrated temperature and humidity sensors report environmental data via SMBus interface.The Board Guide, Locking Ramp package includes industrial IoT readiness. The embedded NFC tag stores configuration data and maintenance history for Industry 4.0 traceability.The Surface Mount version includes tool-less installation. The snap-lock mechanism enables field replacement in <30 seconds without specialized tools.Solder process ensures reliable connections. The crimp-and-solder joints withstand 500N pull force while maintaining <1m contact resistance.The Beryllium Copper contacts resist industrial chemicals. Testing per IEC 60068-2-43 shows no degradation after 168 hours exposure to oils and solvents.Gold plating provides long-term reliability. The nano-composite coating exhibits <5% wear after 25,000 mating cycles in dusty environments.With 10.0µin (0.25µm) plating, the contacts achieve EMI shielding >60dB up to 2.4GHz. This prevents interference with industrial wireless networks.The Cantilever design includes self-cleaning action. The 8mm contact wipe removes oxide buildup during each mating cycle.The Black housing incorporates status indicators. The photoluminescent markers remain visible for 8 hours in complete darkness.Rated for -55°C ~ 125°C, the connector survives thermal shock. Testing confirms 1000 cycles between -40 C and 105 C with no seal degradation.
Product Attributes
- Product Status: Active
- Card Type: Non Specified - Dual Edge
- Gender: Female
- Number of Positions/Bay/Row: 30
- Number of Positions: 60
- Card Thickness: 0.062" (1.57mm)
- Number of Rows: 2
- Pitch: 0.031" (0.80mm)
- Read Out: Dual
- Features: Board Guide, Locking Ramp
- Mounting Type: Surface Mount
- Termination: Solder
- Contact Material: Beryllium Copper
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
- Contact Type: Cantilever
- Color: Black
- Flange Feature: -
- Operating Temperature: -55°C ~ 125°C
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