HSE02-173213P

CUI Devices

General info

Part Number

HSE02-173213P

Manufacturer

CUI Devices

Description:

HEAT SINK, EXTRUSION, 17 X 31.9

Reference Price (USD)

$2.86000

500+

$2.8314

1000+

$2.8028

1500+

$2.7742

2000+

$2.7456

2500+

$2.717

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

HSE02-173213P

$2.86

Product details

CUI Devices's HSE02-173213P delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 0.669" (17.00mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 0.669" (17.00mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.492" (12.50mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Rated for 3.5W @ 75°C in 45 C ambient conditions, the design includes PUE-optimized performance curves. Thermal models account for recirculation effects in hot aisle containment systems.The 6.70°C/W @ 200 LFM performance is validated under ASHRAE TC9.9 Class A3 conditions. The design maintains stability at airflow rates from 10-25 CFM.The 21.44°C/W specification enables emergency operation during cooling system failures. The design maintains processors below 90 C for 15 minutes without airflow.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.Nickel-plated surface ensures long-term reliability in data center environments. The finish resists sulfurization and maintains emissivity >0.85 after 5 years of operation.