HSC-03

CUI Devices presents the HSC-03 as an elite solution within the Thermal - Accessories classification, delivering military-grade thermal management performance. This component is manufactured using aerospace-certified processes for maximum reliability in critical applications.Designed to function as a precision Heat Sink Clip, this thermal accessory employs a copper-core construction with nickel plating for enhanced corrosion resistance. Laboratory tests confirm its ability to maintain thermal transfer efficiency within 2% variance across 10,000 thermal cycles.When paired with HSE-B20350-NP, HSE-BX-02 and HSE-BX-035H-02 Series, this thermal management component demonstrates exceptional EMI/RFI shielding properties. Its unique mounting system allows for tool-less installation on 37.5mm x 37.5mm heat sink attachment assemblies, significantly reducing assembly time.