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HSB28-606022

CUI Devices
HSB28-606022 Preview
HSB28-606022
CUI Devices
HEAT SINK, BGA, 60 X 60 X 22 MM,
Reference Price (USD)
1+
$6.63000
500+
$6.5637
1000+
$6.4974
1500+
$6.4311
2000+
$6.3648
2500+
$6.2985
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB28-606022

HSB28-606022

$6.63

Product details

Product Attributes

  • Product Status: Active
  • Type: -
  • Package Cooled: -
  • Attachment Method: -
  • Shape: -
  • Length: -
  • Width: -
  • Diameter: -
  • Fin Height: -
  • Power Dissipation @ Temperature Rise: -
  • Thermal Resistance @ Forced Air Flow: -
  • Thermal Resistance @ Natural: -
  • Material: -
  • Material Finish: -

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