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HSB21-454515

CUI Devices
HSB21-454515 Preview
HSB21-454515
CUI Devices
HEAT SINK, BGA, 45 X 45 X 15 MM
Reference Price (USD)
1+
$2.03000
500+
$2.0097
1000+
$1.9894
1500+
$1.9691
2000+
$1.9488
2500+
$1.9285
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB21-454515

HSB21-454515

$2.03

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 1.772" (45.00mm)
  • Width: 1.772" (45.00mm)
  • Diameter: -
  • Fin Height: 0.591" (15.00mm)
  • Power Dissipation @ Temperature Rise: 9.9W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 7.56°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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