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HSB18-232310

CUI Devices
HSB18-232310 Preview
HSB18-232310
CUI Devices
HEAT SINK, BGA, 23 X 23 X 10 MM
Reference Price (USD)
1+
$1.04000
500+
$1.0296
1000+
$1.0192
1500+
$1.0088
2000+
$0.9984
2500+
$0.988
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB18-232310

HSB18-232310

$1.04

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 0.906" (23.00mm)
  • Width: 0.906" (23.00mm)
  • Diameter: -
  • Fin Height: 0.394" (10.00mm)
  • Power Dissipation @ Temperature Rise: 3.7W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 6.80°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 20.41°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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