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HSB16-404018

CUI Devices
HSB16-404018 Preview
HSB16-404018
CUI Devices
HEAT SINK, BGA, 40 X 40 X 18 MM
Reference Price (USD)
1+
$2.23000
500+
$2.2077
1000+
$2.1854
1500+
$2.1631
2000+
$2.1408
2500+
$2.1185
Exquisite packaging
Discount
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HSB16-404018

HSB16-404018

$2.23

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 1.575" (40.00mm)
  • Width: 1.575" (40.00mm)
  • Diameter: -
  • Fin Height: 0.709" (18.00mm)
  • Power Dissipation @ Temperature Rise: 9.4W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 2.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 7.96°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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