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HSB15-404010

CUI Devices
HSB15-404010 Preview
HSB15-404010
CUI Devices
HEAT SINK, BGA, 40 X 40 X 10 MM
Reference Price (USD)
1+
$1.10858
500+
$1.0974942
1000+
$1.0864084
1500+
$1.0753226
2000+
$1.0642368
2500+
$1.053151
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB15-404010

HSB15-404010

$1.11

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 1.575" (40.00mm)
  • Width: 1.575" (40.00mm)
  • Diameter: -
  • Fin Height: 0.394" (10.00mm)
  • Power Dissipation @ Temperature Rise: 6.3W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 3.90°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 11.84°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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