The world’s largest selection of electronic components in stock for immediate shipment!

HSB14-353518

CUI Devices
HSB14-353518 Preview
HSB14-353518
CUI Devices
HEAT SINK, BGA, 35 X 35 X 18 MM
Reference Price (USD)
1+
$1.65000
500+
$1.6335
1000+
$1.617
1500+
$1.6005
2000+
$1.584
2500+
$1.5675
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB14-353518

HSB14-353518

$1.65

Product details

Product Attributes

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: BGA
  • Attachment Method: Adhesive
  • Shape: Square, Pin Fins
  • Length: 1.378" (35.00mm)
  • Width: 1.378" (35.00mm)
  • Diameter: -
  • Fin Height: 1.378" (35.00mm)
  • Power Dissipation @ Temperature Rise: 8.4W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 3.60°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 8.97°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

You May Also Be Interested In

Advanced Thermal Solutions Inc.

ATS-09D-94-C2-R0

HEATSINK 40X40X25MM R-TAB T766
Advanced Thermal Solutions Inc.

ATS-X53300B-C1-R0

SUPERGRIP HEATSINK 30X30X7.5MM
Advanced Thermal Solutions Inc.

ATS-EXL76-1220-R0

HEATSINK AL6063 1220X93.4X40MM
Advanced Thermal Solutions Inc.

ATS-03E-184-C2-R0

HEATSINK 40X40X25MM R-TAB T766
Advanced Thermal Solutions Inc.

ATS-17D-184-C2-R0

HEATSINK 40X40X25MM R-TAB T766
Advanced Thermal Solutions Inc.

ATS-07G-64-C2-R0

HEATSINK 40X40X25MM L-TAB T766
iBASE Technology

HSET930-BGA-2

HEAT SPREADER FOR ET930 (H051HSE
Wakefield-Vette

901-19-1-33-2-B-0

HEAT SINK ELLIP FIN 19X19MM CLIP
Aavid, Thermal Division of Boyd Corporation

591202B03100G

BOARD LEVEL HEAT SINK
Advanced Thermal Solutions Inc.

ATS-05F-94-C2-R0

HEATSINK 40X40X25MM R-TAB T766

Expert Quality Assessments

Year-Round Warranty Coverage

Worldwide Sourcing

Round-the-Clock Customer Support

Top