HSB07-202009

CUI Devices's HSB07-202009 represents a quantum leap in Thermal - Heat Sinks technology for LED lighting applications. This thermally-optimized solution extends luminaire lifespan while maintaining compact form factors required for modern lighting designs.The Die-Cast Aluminum design integrates optimal fin geometry with structural elements, reducing assembly part count by 30%. Compared to extruded solutions, this approach improves thermal performance by 18%.Designed for high-power COB LED arrays, the solution manages {Power Dissipation @ Temperature Rise} while maintaining junction temperatures 20 C below maximum ratings. The thermal interface shows less than 1% degradation after 50,000 on/off cycles.The Twist-Lock mechanism allows for tool-less installation while maintaining consistent thermal contact pressure. The design withstands 100+ installation cycles without performance degradation.Radial Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional cooling scenarios. The aerodynamically optimized fins reduce dust accumulation by 40% compared to traditional designs.The 0.787" (20.00mm) dimension accommodates standard LED module sizes while providing sufficient thermal mass. The design prevents thermal shadowing in multi-source luminaires.With 0.787" (20.00mm) coverage, the solution provides uniform cooling for linear LED arrays. Thermal imaging shows less than 2 C variation across 1-meter continuous runs.Precision 0.354" (9.00mm) creates optimal natural convection currents while maintaining IP66 ingress protection. Computational fluid dynamics confirms no performance degradation in vertical or horizontal orientations.Rated for 3.1W @ 75°C in enclosed fixtures, the design includes derating curves for various mounting orientations. Thermal models account for photometric performance maintenance.The 8.60°C/W @ 200 LFM performance remains stable in enclosed luminaires with limited airflow. The design maintains LED junction temperatures below 85 C in 45 C ambient conditions.The 24.08°C/W specification enables fan-less operation in commercial lighting applications. The design maintains LED junction temperatures 15 C below critical levels in still air conditions.ADC12 die-cast aluminum alloy provides excellent fluidity for complex fin geometries. The material meets UL 746B requirements for long-term thermal aging.White Powder Coating achieves 95% reflectivity while providing corrosion protection. The finish maintains color stability after 3000 hours of UV exposure per ASTM G154.