HS-ZX-R1-SET-R1
Enclustra FPGA Solutions
HS-ZX-R1-SET-R1
Enclustra FPGA Solutions
HEATSINK MARS ZX2 ZX3
Reference Price (USD)
1+
$15.89500
500+
$15.73605
1000+
$15.5771
1500+
$15.41815
2000+
$15.2592
2500+
$15.10025
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HS-ZX-R1-SET-R1
$15.90
Product details
The HS-ZX-R1-SET-R1 from Enclustra FPGA Solutions sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.Optimized for mobile SoCs and GPU packages, the solution handles {Power Dissipation @ Temperature Rise} in 35 C ambient conditions. The thermal interface maintains performance through 1000+ power cycles.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: FPGA
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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