HS-MA3-R1-SET-R1
Enclustra FPGA Solutions
HS-MA3-R1-SET-R1
Enclustra FPGA Solutions
HEATSINK MARS MA3
Reference Price (USD)
1+
$15.89500
500+
$15.73605
1000+
$15.5771
1500+
$15.41815
2000+
$15.2592
2500+
$15.10025
Exquisite packaging
Discount
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HS-MA3-R1-SET-R1
$15.90
Product details
The HS-MA3-R1-SET-R1 from Enclustra FPGA Solutions represents cutting-edge thermal management in the Thermal - Heat Sinks category. Engineered for high-performance computing applications, this solution delivers exceptional heat dissipation while maintaining compact form factors. With advanced materials engineering and precision manufacturing, it sets new benchmarks for thermal efficiency in demanding environments.The Top Mount design ensures optimal contact pressure distribution, critical for BGA and LGA package cooling. When compared to traditional skived designs, this extrusion-type heatsink reduces thermal interface resistance by up to 15%.Optimized for high-power ASICs and BGA packages, this solution addresses thermal challenges in 5G base stations and AI accelerator cards. The multi-surface contact architecture supports power dissipation up to {Power Dissipation @ Temperature Rise}.
Product Attributes
- Product Status: Active
- Type: Top Mount
- Package Cooled: FPGA
- Attachment Method: -
- Shape: -
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: -
- Material Finish: -
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