HP-CWS-R08-250-N
Aavid, Thermal Division of Boyd Corporation
HP-CWS-R08-250-N
Aavid, Thermal Division of Boyd Corporation
COPPER-WATER HEAT PIPE, ROUND, D
Reference Price (USD)
1+
$12.76000
500+
$12.6324
1000+
$12.5048
1500+
$12.3772
2000+
$12.2496
2500+
$12.122
Exquisite packaging
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HP-CWS-R08-250-N
$12.76
Product details
Aavid, Thermal Division of Boyd Corporation's HP-CWS-R08-250-N redefines thermal management benchmarks in the Thermal - Heat Pipes, Vapor Chambers category. Optimized for next-generation computing architectures, this thermal solution combines innovative wick structures with military-spec construction for reliable operation in harsh conditions.Functioning as a Heat Pipe, the device employs two-phase heat transfer principles to achieve 5x better thermal conductivity than copper blocks. The vapor chamber variant features micro-channel reinforcement for 400W+ applications.Supporting Epoxy or Solder installation techniques, the system accommodates both permanent and serviceable thermal interfaces. Epoxy-mounted versions demonstrate 1000+ thermal cycles reliability.The Round configuration is aerodynamically optimized for forced convection systems. Rectangular profiles show 18% lower pressure drop in wind tunnel tests.Capable of handling 80.0W @ 250mm thermal loads, the solution manages heat flux densities up to 300W/cm . The 110W model is ideal for FPGA cooling.Utilizing Sintered fluid transport technology, the capillary action maintains continuous phase-change cycles. Grooved designs achieve 0.15mm effective pore size for high-G applications.Available in 9.843" (250.00mm) variants, the modular design enables custom thermal path optimization. The 450mm version is specifically engineered for rack-mounted server cooling.The 0.315" (8.00mm) OD circular models provide isotropic heat spreading for cylindrical packages. The 10mm OD version is optimized for laser diode cooling.Reliable across -55°C ~ 180°C extremes, the solution features aerospace-grade sealing. The 180 C variant is qualified for under-hood automotive applications.Fabricated from Copper substrates, the construction balances weight and performance. Aluminum versions achieve 230 W/m K conductivity at 40% weight reduction.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Round
- Power - Cooling: 80.0W @ 250mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 9.843" (250.00mm)
- Width: -
- Height: -
- Diameter: 0.315" (8.00mm) OD
- Operating Temperature: -55°C ~ 180°C
- Features: -
- Material: Copper
- Platform: -
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