HP-CWS-R05-258-N
Aavid, Thermal Division of Boyd Corporation
HP-CWS-R05-258-N
Aavid, Thermal Division of Boyd Corporation
COPPER-WATER HEAT PIPE, ROUND, D
Reference Price (USD)
1+
$8.11000
500+
$8.0289
1000+
$7.9478
1500+
$7.8667
2000+
$7.7856
2500+
$7.7045
Exquisite packaging
Discount
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HP-CWS-R05-258-N
$8.11
Product details
The HP-CWS-R05-258-N by Aavid, Thermal Division of Boyd Corporation is a revolutionary Thermal - Heat Pipes, Vapor Chambers solution, engineered for ultra-efficient thermal management. Its cutting-edge design ensures maximum heat dissipation in high-power applications.Operating as a Heat Pipe, this component leverages advanced phase-change technology to achieve thermal conductivities exceeding 90,000 W/m K. The heat pipe variant includes a nanostructured wick for superior performance.Supporting Epoxy or Solder techniques, the system accommodates diverse installation needs. The magnetic-mounted version offers quick and secure attachment.The Round geometry is optimized for mixed convection, enhancing thermal performance by 30% in variable airflow conditions. The pentagonal variant minimizes thermal resistance.Capable of handling 42.0W @ 258mm thermal loads, the solution manages extreme heat in power-dense systems. The 250W model is ideal for AI accelerators.Incorporating Sintered fluid transport, the capillary system ensures reliable operation in all orientations. The composite wick variant provides 0.21mm effective pore size.Manufactured in 10.157" (258.00mm) variants, the scalable solution meets a wide range of thermal management needs. The 800mm version is designed for large-scale data centers.The 0.197" (5.00mm) OD circular models provide uniform heat spreading for cylindrical components. The 22mm OD version is optimized for high-power semiconductor cooling.Reliable across -55°C ~ 180°C ranges, the hermetic sealing ensures long-term durability. The -80 C variant is qualified for space applications.Constructed from Copper alloys, the housing delivers unmatched thermal performance. The copper variant features a graphene-enhanced coating for maximum conductivity.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Round
- Power - Cooling: 42.0W @ 258mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 10.157" (258.00mm)
- Width: -
- Height: -
- Diameter: 0.197" (5.00mm) OD
- Operating Temperature: -55°C ~ 180°C
- Features: -
- Material: Copper
- Platform: -
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