HP-CWS-R05-200-N
Aavid, Thermal Division of Boyd Corporation
HP-CWS-R05-200-N
Aavid, Thermal Division of Boyd Corporation
COPPER-WATER HEAT PIPE, ROUND, D
Reference Price (USD)
1+
$7.59000
500+
$7.5141
1000+
$7.4382
1500+
$7.3623
2000+
$7.2864
2500+
$7.2105
Exquisite packaging
Discount
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HP-CWS-R05-200-N
$7.59
Product details
The HP-CWS-R05-200-N from Aavid, Thermal Division of Boyd Corporation represents cutting-edge thermal management technology in the Thermal - Heat Pipes, Vapor Chambers segment. Engineered for mission-critical applications, this solution delivers unparalleled heat dissipation efficiency through advanced phase-change mechanisms. With configurable form factors and military-grade materials, it ensures optimal thermal conductivity across demanding operating environments.Designed as a Heat Pipe, this component utilizes phase-change thermodynamics to achieve superior heat transfer rates compared to conventional solid conductors. Its dual-mode compatibility supports both vapor chamber and heat pipe configurations.Featuring multiple Epoxy or Solder options, the system accommodates diverse mounting requirements from high-vibration industrial setups to precision aerospace assemblies. The solder-attached variant demonstrates 40% higher shear strength than industry standards.The Round geometry is optimized for maximizing surface contact area while minimizing airflow obstruction. Computational fluid dynamics simulations validate its 15% better thermal uniformity than competing profiles.Rated for 52.0W @ 200mm thermal loads, the solution handles transient heat spikes common in power electronics. The 150W capacity version supports overclocked CPU cooling at 95 C ambient.Incorporating Sintered capillary structures, the wicking mechanism achieves 0.25mm effective pore size for exceptional anti-gravity performance. Sintered copper variants exhibit 30% greater liquid return capacity.Available in 7.874" (200.00mm) dimensions, the scalable architecture supports thermal bridging across PCB layouts from compact IoT modules to server-grade component arrays. The 500mm version maintains <0.5 C/mm temperature gradient.The 0.197" (5.00mm) OD circular variants provide omnidirectional heat spreading for cylindrical components. The 12mm OD version supports 200W LED array cooling.Stable across -55°C ~ 180°C ranges, the hermetic sealing prevents performance degradation in extreme environments. The -55 C variant is MIL-STD-810G compliant.Constructed from Copper alloys, the housing combines corrosion resistance with exceptional thermal diffusivity. Copper versions achieve 401 W/m K conductivity ratings.
Product Attributes
- Product Status: Active
- Type: Heat Pipe
- Attachment Method: Epoxy or Solder
- Shape: Round
- Power - Cooling: 52.0W @ 200mm
- Thermal Resistance: -
- Wick Type: Sintered
- Length: 7.874" (200.00mm)
- Width: -
- Height: -
- Diameter: 0.197" (5.00mm) OD
- Operating Temperature: -55°C ~ 180°C
- Features: -
- Material: Copper
- Platform: -
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