HM2P09PK5110BALF

The HM2P09PK5110BALF by Amphenol ICC (FCI) establishes new benchmarks in Backplane Connectors - Hard Metric, Standard for IoT edge computing devices. Designed for smart city infrastructure, this connector series combines ultra-low power consumption with robust environmental sealing. Its innovative architecture supports distributed sensor networks and gateway applications where reliability and energy efficiency are critical.Featuring Header, Male Pins topology, this smart connector integrates embedded diagnostics that reduce field maintenance costs by 45%. The active contact monitoring system predicts wear before failure occurs.The C 11 form factor incorporates patent-pending dust mitigation technology that outperforms IP6X requirements. Field tests show 98% particulate rejection in outdoor installations.With 55 configurable channels, this solution enables adaptive IoT node architectures. The dynamic pin assignment supports both power-over-Ethernet and low-speed sensor interfaces.The All configuration optimizes power delivery for energy-harvesting applications. Ultra-low resistance contacts (sub-5m ) maximize power transfer efficiency.The 0.079" (2.00mm) micro-spacing enables 60% more compact designs than standard IoT connectors while maintaining 250VAC isolation. The precision-molded housing prevents dendritic growth in humid conditions.The 5 contact matrix provides optimal signal routing for multi-protocol gateways. This arrangement reduces signal path length by 35% compared to conventional layouts.Engineered for Through Hole deployment, this connector features tamper-resistant mounting that meets ANSI/ISA-62443-3-3 cybersecurity requirements. The anti-vandal design withstands 50Nm torque attempts.The Press-Fit process creates cold-weld joints that maintain conductivity after 1000 thermal shock cycles (-40 C to +85 C). The gas-tight connections prevent oxidation in sulfur-rich environments.The Gold surface treatment provides exceptional performance in polluted atmospheres. Testing shows less than 2% contact resistance change after 5-year accelerated aging.With 30.0µin (0.76µm) noble metal deposition, the contacts achieve 100,000 mating cycles while maintaining sub-10m resistance. This coating thickness is optimized for low-energy contact systems.