HDWM-12-60-G-S-370

Designed for reliability in extreme conditions, Samtec Inc.'s HDWM-12-60-G-S-370 sets new benchmarks in Rectangular Connectors - Board Spacers, Stackers (Board to Board) performance. This ruggedized interconnect solution combines military-grade construction with precision electrical characteristics for mission-critical systems.With 12 available positions, this connector supports complex system architectures. The scalable design maintains signal integrity even in high-density configurations.The 0.050" (1.27mm) pitch configuration minimizes signal skew in high-speed parallel interfaces. This spacing has been optimized through extensive electromagnetic field simulations.The 1-row architecture provides balanced current distribution for power applications. This design feature significantly reduces parasitic inductance in high-current paths.The 0.825" (20.955mm) pin length ensures proper mechanical engagement in various PCB stackups. The precision-machined pins maintain consistent mating force across all positions.With 0.335" (8.509mm) mating post length, the connector achieves optimal contact pressure distribution. This design feature prevents fretting corrosion in vibration-prone environments.The 0.370" (9.400mm) stack height enables flexible system packaging solutions. This dimension has been optimized through thermal-mechanical stress analysis.The 0.120" (3.048mm) tail length has been optimized for high-reliability soldering processes. This dimension ensures proper solder fillet formation in both manual and automated assembly.Available in Through Hole variants, the connector supports diverse manufacturing requirements. The through-hole version features reinforced solder joints for mechanical durability.The Solder termination method has been qualified for high-reliability applications. The solder joint design exceeds IPC-A-610 Class 3 requirements.Employing Gold plating technology, the contacts deliver exceptional corrosion resistance. The advanced finish formulation has been tested in salt spray environments.The 10.0µin (0.25µm) plating thickness provides optimal wear characteristics. This specification has been validated through extensive mating cycle testing.The Black housing material incorporates conductive additives for ESD protection. The compound maintains its mechanical properties across the full military temperature range.