HDB-M4-060M226X
Amphenol Aerospace Operations
HDB-M4-060M226X
Amphenol Aerospace Operations
MOTHER BOARD 60POS
Reference Price (USD)
1+
$134.95000
500+
$133.6005
1000+
$132.251
1500+
$130.9015
2000+
$129.552
2500+
$128.2025
Exquisite packaging
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HDB-M4-060M226X
$134.95
Product details
Amphenol Aerospace Operations's HDB-M4-060M226X establishes new standards in Backplane Connectors - Specialized technology, specifically developed for renewable energy power conversion systems. This high-current connector solution combines robust power handling capabilities with precision signal transmission for smart grid applications.Specifically engineered for Backplane, Motherboard implementations, this connector series excels in battery energy storage systems.The Receptacle, Female Sockets interface configuration provides solar inverter designers with a reliable solution for high-power density interconnects.Featuring High Density (HDC, HDI, HPC) technology, this connector series demonstrates exceptional performance in high-voltage power distribution applications.With 60 available positions, the connector enables comprehensive system integration for wind turbine control systems.The All loaded configuration offers optimized solutions for power monitoring and control circuits in smart grid applications.The 0.070" (1.78mm) spacing configuration allows for adequate creepage and clearance distances required in high-voltage designs.6 row implementation facilitates efficient heat dissipation in power semiconductor applications.The 10 column arrangement supports balanced three-phase power distribution in industrial inverters.The Through Hole mounting system ensures reliable PCB attachment in high-vibration wind power generation equipment.The Solder method has been optimized for high-reliability connections in fluctuating temperature environments.Key Jackscrew include arc-resistant materials and safety interlocks essential for high-voltage power conversion equipment.Tin-Lead plating ensures minimal contact resistance for efficient power transmission in photovoltaic systems.100.0µin (2.54µm) plating thickness ensures long-term reliability in harsh outdoor conditions.The Black housing material provides UV resistance for outdoor renewable energy applications.
Product Attributes
- Product Status: Active
- Connector Usage: Backplane, Motherboard
- Connector Type: Receptacle, Female Sockets
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 60
- Number of Positions Loaded: All
- Pitch: 0.070" (1.78mm)
- Number of Rows: 6
- Number of Columns: 10
- Mounting Type: Through Hole
- Termination: Solder
- Contact Layout, Typical: -
- Features: Jackscrew
- Contact Finish: Tin-Lead
- Contact Finish Thickness: 100.0µin (2.54µm)
- Color: Black
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