HDB-D4-120M042X
Amphenol Aerospace Operations
HDB-D4-120M042X
Amphenol Aerospace Operations
DAUGHTER CARD 120POS
Reference Price (USD)
1+
$307.03000
500+
$303.9597
1000+
$300.8894
1500+
$297.8191
2000+
$294.7488
2500+
$291.6785
Exquisite packaging
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HDB-D4-120M042X
$307.03
Product details
The HDB-D4-120M042X by Amphenol Aerospace Operations revolutionizes Backplane Connectors - Specialized technology, specifically engineered for hyperscale data center applications. This high-density interconnect solution delivers unmatched signal integrity while supporting next-generation computing architectures.Specifically developed for Daughtercard implementations, this series excels in co-packaged optics interconnect applications.Featuring Receptacle, Female Sockets configuration, this connector series provides optimal performance for 224G PAM4 signaling in switch fabric applications.The High Density (HDC, HDI, HPC) design incorporates advanced crosstalk suppression techniques, critical for maintaining eye diagram integrity in high-speed serial links.With 120 available positions, this solution enables unprecedented port density for top-of-rack switching equipment.The All loaded variant offers power-efficient solutions for partial population scenarios in server backplanes.The 0.070" (1.78mm) micro-pitch design enables breakthrough density while maintaining impedance control for 112G SerDes channels.12 row configuration supports orthogonal direct-attach copper architectures in disaggregated server designs.The 10 column architecture enables efficient routing of wide parallel buses in memory-centric computing systems.Through Hole, Right Angle installation method ensures precise coplanarity for reliable surface-mount assembly in automated PCB production lines.The Solder process has been optimized for low-void solder joints in mass reflow processes per IPC-7095C standards.Key Jackscrew include integrated heat spreaders and airflow-optimized housings for thermal management in high-performance computing applications.Gold plating technology provides superior wear resistance exceeding 10,000 mating cycles for data center hot-swap scenarios.30.0µin (0.76µm) coating thickness ensures compliance with IEC 60512-99-001 fretting corrosion requirements.The Black housing material incorporates laser-markable surfaces for traceability in automated manufacturing environments.
Product Attributes
- Product Status: Active
- Connector Usage: Daughtercard
- Connector Type: Receptacle, Female Sockets
- Connector Style: High Density (HDC, HDI, HPC)
- Number of Positions: 120
- Number of Positions Loaded: All
- Pitch: 0.070" (1.78mm)
- Number of Rows: 12
- Number of Columns: 10
- Mounting Type: Through Hole, Right Angle
- Termination: Solder
- Contact Layout, Typical: -
- Features: Jackscrew
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Color: Black
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