HD6417708RF100AV
Renesas Electronics America Inc
HD6417708RF100AV
Renesas Electronics America Inc
IC MCU 32BIT ROMLESS 144LQFP
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Product details
Renesas Electronics America Inc's HD6417708RF100AV sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The SH-2 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 100MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With EBI/EMI, SCI, SmartCard protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.The comprehensive POR, WDT suite includes automotive-specific features like crank-angle measurement interfaces and injector drive timers, reducing external component count in engine management systems.8 programmable interfaces support mixed-voltage operation from 1.8V to 5V, simplifying integration with legacy automotive sensors and actuators.The ROMless implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.An automotive-grade 3.15V ~ 3.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.External clocking architecture maintains <50ppm frequency stability across the entire automotive temperature range, ensuring reliable CAN bus timing.Qualified for -20°C ~ 75°C (TA), the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.144-LQFP packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in 144-LQFP (20x20), the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Active
- Core Processor: SH-2
- Core Size: 32-Bit Single-Core
- Speed: 100MHz
- Connectivity: EBI/EMI, SCI, SmartCard
- Peripherals: POR, WDT
- Number of I/O: 8
- Program Memory Size: -
- Program Memory Type: ROMless
- EEPROM Size: -
- RAM Size: -
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 3.6V
- Data Converters: -
- Oscillator Type: External
- Operating Temperature: -20°C ~ 75°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
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