HB01S25H2P1

The HB01S25H2P1 from JAE Electronics delivers breakthrough performance in Rectangular Connectors - Contacts, specifically tailored for 5G infrastructure applications. Its innovative design addresses the unique challenges of millimeter-wave signal transmission.The Power manufacturing process guarantees consistent performance across all contacts in high-density arrays. This precision is mandatory for phased array antenna systems requiring uniform signal propagation.Featuring Socket architecture, the connector maintains impedance control up to 40GHz, essential for 5G RF front-end modules. The contact geometry minimizes signal reflection while maximizing bandwidth utilization.The Crimp system provides ultra-low insertion loss, critical for maintaining signal-to-noise ratio in sensitive receiver circuits. This termination style has been optimized for high-frequency performance.Compatible with 14-16 AWG wiring, the contacts ensure proper skin effect management at microwave frequencies. The precision-engineered contact points minimize signal attenuation in high-speed data links.The Gold plating was selected for its exceptional high-frequency characteristics, providing stable contact resistance across wide temperature fluctuations. This finish outperforms standard options in multipaction testing.