HB01P25H3P1

Engineered for photonic integration, JAE Electronics's HB01P25H3P1 sets new benchmarks in Rectangular Connectors - Contacts performance. This optical-electrical hybrid connector enables seamless signal conversion in silicon photonics applications.The Power manufacturing process uses active alignment techniques to achieve sub-micron positional accuracy between optical and electrical elements. This precision enables co-packaged optics solutions.The Pin configuration combines optical ferrule alignment with electrical contacts in a unified package. This innovative design achieves <0.1dB insertion loss while maintaining 100Gbps electrical throughput.Utilizing Crimp technology, the electrical contacts provide impedance-matched transitions to photonic ICs. The termination scheme minimizes back reflection at optical-electrical interfaces.Optimized for 17-19 AWG high-speed differential pairs, the contacts maintain 90 characteristic impedance up to 50GHz. The precision geometry prevents mode conversion in mixed-signal environments.The Gold employs transparent conductive oxides that maintain both electrical performance and optical clarity. This dual-function coating is essential for through-lens contact applications.