H2183-01

Harwin Inc.

General info

Part Number

H2183-01

Manufacturer

Harwin Inc.

Description:

CONN PC PIN 1.75MM DIA TIN 9.5MM

Reference Price (USD)

$0.58000

500+

$0.5742

1000+

$0.5684

1500+

$0.5626

2000+

$0.5568

2500+

$0.551

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

H2183-01

$0.58

Product details

The H2183-01 by Harwin Inc. revolutionizes Terminals - PC Pin, Single Post Connectors technology with its cutting-edge design for quantum computing applications. Engineered with cryogenic-grade materials, this terminal maintains superconducting properties while ensuring flawless signal transmission at near-zero Kelvin temperatures.Featuring PC Pin architecture, the terminal incorporates quantum tunneling barriers that prevent electron leakage in qubit control systems.The Single End configuration achieves 99.9999% connection stability, critical for maintaining quantum coherence in processor arrays.With 0.070" (1.78mm) Dia nanoscale precision, the contacts minimize parasitic capacitance while maximizing Josephson junction efficiency.The 0.070" (1.78mm) Dia geometry prevents anomalous heating effects during quantum state measurement.The 0.374" (9.50mm) dimension is optimized for dilution refrigerator integration, preventing thermal bridging in multi-stage cooling systems.Optimized 0.077" (1.95mm) dimension creates ideal microwave coupling for qubit readout resonators.Designed with 0.467" (11.86mm) ultra-compact profile, the terminal enables high-density qubit packaging without crosstalk interference.The 0.089" (2.25mm) incorporates superconducting niobium shielding that prevents magnetic flux penetration in sensitive quantum circuits.Precision 0.071" ~ 0.075" (1.80mm ~ 1.90mm) tolerances maintain vacuum integrity in ultra-high vacuum (UHV) chamber installations.Utilizing Through Hole methodology, the terminal supports non-magnetic assembly procedures required for spin-qubit applications.Swage technology ensures picosecond-level signal propagation delays, crucial for quantum error correction timing.Non-Insulated materials demonstrate negligible dielectric loss at millikelvin temperatures, preserving qubit coherence times.Compatible with 0.063" (1.60mm) silicon interposers used in 3D quantum processor stacking architectures.The Brass formulation exhibits zero resistance below critical temperature thresholds for superconducting computing.Specialized Tin surface treatment prevents quasiparticle generation in microwave pulse environments.