H-33-BIN

Engineered for next-generation computing infrastructure, 3M's H-33-BIN delivers breakthrough performance in Terminals - Wire Splice Connectors technology. This high-speed interconnect solution enables 400G Ethernet and AI accelerator applications with unprecedented signal integrity.The Twist On Wire Cap architecture implements differential pair routing that maintains 100 impedance tolerance. When deployed in server backplanes, it demonstrates <0.5ps skew across 56G PAM4 channels.Featuring Varies by Wire Size pathways, this connector supports orthogonal direct-connect architectures. Benchmark tests show 40% reduction in crosstalk compared to traditional mezzanine designs.Utilizing Twist On technology, the connector achieves <0.2dB/inch insertion loss at 28GHz. The patented via design minimizes stub reflections in multilayer PCB applications.Optimized for 14-22 AWG controlled impedance cables, this solution enables 112G SerDes implementations. The precision alignment features ensure <5 m positional tolerance during blind mating.The Fully Insulated system employs low-Dk materials with 0.02 dissipation factor at 10GHz. This ultra-pure dielectric maintains eye diagram integrity in long-reach copper interconnects.Designed with Copper Wire Only, this connector series supports 25.6Tbps aggregate bandwidth. The integrated heat sink design maintains temperatures below 85 C at full operational load.Yellow identifiers follow Open Compute Project standards for hyperscale data centers. The laser-etched markings withstand repeated cleaning cycles in server hot aisles.