GPHC3.0-0.020-02-0816
Bergquist
GPHC3.0-0.020-02-0816
Bergquist
THERM PAD 406.4MMX203.2MM BLUE
Reference Price (USD)
1+
$87.98000
500+
$87.1002
1000+
$86.2204
1500+
$85.3406
2000+
$84.4608
2500+
$83.581
Exquisite packaging
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GPHC3.0-0.020-02-0816
$87.98
Product details
Bergquist's GPHC3.0-0.020-02-0816 introduces groundbreaking Thermal - Pads, Sheets technology for quantum computing applications. This ultra-precision thermal solution maintains cryogenic stability while providing exceptional thermal isolation for qubit control systems.As a cryogenic Gap Filler Pad, Sheet, this product combines ultra-low thermal conductivity with perfect electrical insulation. The specially engineered dielectric properties prevent signal interference in sensitive quantum measurement circuits.Fabricated in precision Rectangular configurations, this material accommodates complex qubit array geometries. The nanoscale-edge finishing ensures perfect interface contact without damaging delicate quantum components.With 406.40mm x 203.20mm dimensions, this solution fits standard dilution refrigerator cold plates. The size-optimized design allows for efficient thermal management in multi-layer quantum computing stacks.The atomically controlled 0.0200" (0.508mm) provides perfect balance between thermal isolation and mechanical stability. This characteristic is critical for maintaining qubit coherence times in operating conditions.Featuring Tacky - Both Sides properties, this solution offers cryogenic-compatible bonding. The specialized formulation maintains adhesion integrity across extreme temperature ranges without outgassing.The Fiberglass system ensures contamination-free handling in cleanroom environments. This ultra-clean release mechanism prevents particulate generation during installation.The Blue identification system facilitates quick material verification under cryogenic conditions. This specialized coloring remains visible even at liquid helium temperatures.Achieving 3.0W/m-K performance, this material provides precise thermal isolation for qubit arrays. The engineered phonon scattering properties enable fine-grained temperature control.
Product Attributes
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 406.40mm x 203.20mm
- Thickness: 0.0200" (0.508mm)
- Material: -
- Adhesive: Tacky - Both Sides
- Backing, Carrier: Fiberglass
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K
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