G120B-SM-373

The G120B-SM-373 from GHI Electronics, LLC represents a cutting-edge solution in the Embedded - Microcontroller, Microprocessor, FPGA Modules segment, engineered for high-performance embedded systems. This module combines advanced signal processing capabilities with robust power efficiency, making it ideal for 5G infrastructure and edge computing applications where low-latency operation is critical.Featuring a versatile MCU Core architecture, this component delivers exceptional flexibility for multi-core processing tasks. When compared to conventional designs, its hybrid FPGA-MPU configuration enables superior parallel computation while maintaining precise clock synchronization across all cores.At the heart of the system lies the ARM® Cortex®-M3, optimized for real-time digital signal processing with its advanced pipeline architecture. The processor's instruction set acceleration ensures deterministic execution cycles, crucial for industrial automation timing constraints.Operating at 120MHz, the module achieves industry-leading performance-per-watt metrics. This clock frequency has been carefully validated to maintain signal integrity while minimizing electromagnetic interference in dense PCB layouts.With 512KB (Internal), 4MB (External) of non-volatile memory, the device offers ample storage for firmware and configuration data. The flash memory subsystem incorporates error correction codes (ECC) to ensure data reliability in mission-critical aerospace applications.The 96KB (Internal), 16MB (External) high-speed memory supports demanding multi-threaded operations. Its low-latency access architecture is particularly effective for buffering high-bandwidth sensor data in autonomous driving systems.Measuring just 1.50" x 1.05" (38.1mm x 26.7mm), this compact form factor enables high-density installations. The precision-engineered package maintains thermal performance characteristics essential for medical imaging equipment.Rated for -40°C ~ 85°C (TA), the module delivers reliable operation in extreme conditions. This temperature resilience, combined with conformal coating options, makes it suitable for outdoor IoT deployments in harsh climates.