FX8C-100P-SV1(71)

Hirose Electric Co Ltd's FX8C-100P-SV1(71) represents the next generation of Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board), optimized for industrial automation systems. This ruggedized connector solution combines high reliability with exceptional EMI shielding performance, making it suitable for factory floor applications where vibration and electrical noise are prevalent.The Header, Outer Shroud Contacts design incorporates advanced shielding technology that exceeds IEC 61000-4-3 standards. Unlike conventional connectors, this design provides 360 EMI protection without compromising mating durability.Configuration options ranging from 100 allow for scalable I/O expansion in modular control systems. The balanced contact arrangement minimizes ground bounce effects in high-current applications.Precision-engineered 0.024" (0.60mm) spacing enables reliable connections in dust-prone environments. The anti-wicking design prevents contamination migration between contacts.The 2 row architecture provides optimal current distribution for power-hungry industrial sensors. This configuration reduces voltage drop across the connector by up to 40%.Engineered for Surface Mount installation, the connector withstands mechanical stress exceeding 50G shock loads. The reinforced mounting points are IP67 compliant when properly mated.Critical Board Guide ensure operation in extended temperature ranges from -40 C to +125 C. These industrial-grade features include corrosion-resistant materials and vibration-proof retention mechanisms.The specialized Gold formulation resists fretting corrosion caused by micro-vibrations. Independent testing shows 3x better performance than standard finishes in sulfur-rich environments.Flexible 6mm, 11mm options accommodate various backplane architectures in control cabinets. The system supports hot-swapping without signal integrity degradation.The 0.214" (5.45mm) profile allows for adequate airflow in enclosed industrial controllers. This design consideration prevents thermal buildup in continuous operation scenarios.