FSI-110-03-H-D-AB

The FSI-110-03-H-D-AB by Samtec Inc. redefines Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) for IoT edge computing devices. This ultra-compact connector solution combines high-speed data transmission with power-over-Ethernet capabilities, making it perfect for smart city infrastructure and industrial IoT gateways.Featuring a Stacking Compression design, this connector achieves 40Gbps data rates while maintaining PoE++ compatibility. The hybrid architecture supports simultaneous power delivery and high-speed differential signaling.With 20 contact arrangements available, designers can implement mixed-signal configurations. The optimized layout minimizes ground loop interference in sensor fusion applications.The micro 0.039" (1.00mm) spacing enables compact designs for space-constrained IoT nodes. This precision spacing has been validated for 10-year reliability in outdoor temperature cycling conditions.The 2 row configuration provides isolated power and signal paths. This arrangement prevents noise coupling between sensitive analog sensors and digital processors.Optimized for Surface Mount installation, the connector features self-aligning guides for blind mating. The design withstands 500+ insertion cycles in field-serviceable equipment.Key Board Guide include IP68-rated sealing and UV-resistant housing. These environmental protections ensure reliable operation in harsh outdoor deployments.The Gold technology prevents oxidation in high-humidity environments. Testing shows contact resistance stability within 2m after 1,000 humidity cycles.With 30.0µin (0.76µm) protection, the contacts maintain reliable connections despite micro-motion. This specification is critical for vibration-prone industrial environments.The low 0.118" (3.00mm) profile minimizes wind loading in outdoor installations. This design consideration is crucial for antenna-mounted IoT devices.