FMS7401LVN
Fairchild Semiconductor
FMS7401LVN
Fairchild Semiconductor
8-BIT, EEPROM, 2.04MHZ
Reference Price (USD)
1+
$2.31000
500+
$2.2869
1000+
$2.2638
1500+
$2.2407
2000+
$2.2176
2500+
$2.1945
Exquisite packaging
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Product details
Fairchild Semiconductor's FMS7401LVN redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Digital Power Controller implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The 8-Bit architecture incorporates branch prediction and speculative execution for improved DSP performance. Cryptographic extensions accelerate AES-256 operations by 8x compared to software implementations.Supporting EEPROM (1kB) configurations, the memory controller implements error detection and correction. The dual-bank flash architecture enables secure over-the-air updates without service interruption.The 64 x 8 memory subsystem implements parity protection for all SRAM blocks. The memory controller supports both little-endian and big-endian data formats for protocol flexibility.The 6 programmable GPIOs feature Schmitt trigger inputs for noise immunity. Configurable open-drain outputs support direct LED driving without external transistors.The 2.7V ~ 3.6V power architecture implements adaptive body biasing for leakage current reduction. The integrated buck converter achieves 92% power efficiency across load variations.Certified for -40°C ~ 125°C operation, the device utilizes copper pillar bump technology for enhanced thermal conductivity. The package design minimizes thermal resistance to PCB substrates.The Through Hole option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 8-DIP (0.300", 7.62mm) format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in 8-DIP configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.
Product Attributes
- Product Status: Obsolete
- Applications: Digital Power Controller
- Core Processor: 8-Bit
- Program Memory Type: EEPROM (1kB)
- Controller Series: -
- RAM Size: 64 x 8
- Interface: -
- Number of I/O: 6
- Voltage - Supply: 2.7V ~ 3.6V
- Operating Temperature: -40°C ~ 125°C
- Mounting Type: Through Hole
- Package / Case: 8-DIP (0.300", 7.62mm)
- Supplier Device Package: 8-DIP