FI-XC3-B-1-15000
JAE Electronics
FI-XC3-B-1-15000
JAE Electronics
CONN BLADE 30-36AWG CRIMP GOLD
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Product details
The FI-XC3-B-1-15000 by JAE Electronics represents a paradigm shift in Rectangular Connectors - Contacts for fusion energy research. Its plasma-facing design maintains electrical integrity in extreme magnetic confinement environments.Featuring Blade architecture, the connector withstands 10 Tesla magnetic fields without inducing eddy currents. The non-conductive housing material prevents plasma disruption events.The Crimp method employs ceramic-insulated feedthroughs that maintain 40kV isolation in hydrogen plasma. This design is validated for ITER-class tokamak installations.Designed for 30-36 AWG superconducting busbars, the contact system handles 100kA pulses without quenching. The cryogenic-compatible materials prevent thermal runaway in magnet systems.The Gold utilizes boron nitride composites that resist neutron flux degradation. This specialized coating maintains conductivity after 10^18 n/cm^2 exposure.With millimeter-scale 3.94µin (0.10µm), the insulation barrier prevents vacuum arcs while withstanding 1MW/m^2 heat fluxes. This specification is critical for divertor region installations.
Product Attributes
- Product Status: Obsolete
- Type: -
- Pin or Socket: Blade
- Contact Termination: Crimp
- Wire Gauge: 30-36 AWG
- Contact Finish: Gold
- Contact Finish Thickness: 3.94µin (0.10µm)
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