FHS-A9015S00
Delta Electronics
FHS-A9015S00
Delta Electronics
FAN CPU COOLER 90X30MM 12VDC
Reference Price (USD)
1+
$12.44000
500+
$12.3156
1000+
$12.1912
1500+
$12.0668
2000+
$11.9424
2500+
$11.818
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
FHS-A9015S00
$12.44
Product details
The FHS-A9015S00 by Delta Electronics revolutionizes thermal management in the Thermal - Heat Sinks sector, specifically tailored for renewable energy inverters. This advanced solution combines superior heat dissipation with rugged environmental protection, ensuring reliable performance in solar and wind power applications.The Top Mount Extruded design features optimized fin geometry that reduces thermal resistance by 22% compared to standard profiles. When subjected to IEC 60068-2-52 salt spray testing, the corrosion resistance exceeds 1000 hours.Designed for high-power IGBT modules, this solution handles {Power Dissipation @ Temperature Rise} in 85 C ambient conditions. The thermal interface maintains stability across 20,000+ power cycles, critical for solar farm operations.The Spring Clip system provides consistent mounting pressure (15-25N) across all PCB thicknesses (1.0-3.2mm). Field testing demonstrates vibration resistance up to 5g RMS in wind turbine applications.Hexagonal Pin Fin configuration achieves {Thermal Resistance @ Forced Air Flow} in multidirectional airflow environments. Computational analysis shows 15% better turbulence management than traditional square pin designs.For cylindrical busbar connections, the 3.543" (90.00mm) OD variant offers 270 cooling coverage. The design withstands 300A continuous current without thermal derating.Precision-engineered 1.181" (30.00mm) optimizes performance in both natural and forced convection scenarios. The staggered fin arrangement reduces boundary layer thickness by 20%.The 0.52°C/W performance enables reliable operation during cooling fan failures. The design maintains critical components below 125 C in zero-airflow conditions for 45 minutes.Aluminum 6063-T6 alloy provides optimal balance between thermal conductivity (201 W/m K) and structural integrity. The material meets UL 94 V-0 flammability requirements.
Product Attributes
- Product Status: Obsolete
- Type: Board Level
- Package Cooled: Intel LGA1156 & LGA1155 Cooler
- Attachment Method: Bolt On
- Shape: Round
- Length: -
- Width: -
- Diameter: 3.543" (90.00mm) OD
- Fin Height: 1.181" (30.00mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 0.52°C/W
- Material: Aluminum, Plastic
- Material Finish: -
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