FA5B010HP1
JAE Electronics
FA5B010HP1
JAE Electronics
CONN FPC BOTTOM 10POS 0.50MM SMD
Reference Price (USD)
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$3.65403
500+
$3.6174897
1000+
$3.5809494
1500+
$3.5444091
2000+
$3.5078688
2500+
$3.4713285
Exquisite packaging
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FA5B010HP1
$3.65
Product details
JAE Electronics's FA5B010HP1 sets new benchmarks in FFC, FPC (Flat Flexible) Connectors technology, optimized for mission-critical signal transmission. This high-reliability connector combines advanced materials science with precision engineering to deliver unmatched performance in 5G infrastructure applications.Designed specifically for FPC implementations, this connector features impedance-matched signal paths. The embedded shielding technology reduces EMI by 15dB compared to standard designs.The Board Edge, Cutout configuration enables high-speed pick-and-place assembly. Vision-system compatible fiducials ensure 0.05mm placement accuracy.Engineered with Contacts, Bottom topology, this solution provides 360 shielding effectiveness. The multi-point contact system distributes current flow evenly.Supporting 10 contact positions, this high-density interconnect maintains 100 differential impedance. The staggered contact arrangement minimizes crosstalk.The 0.020" (0.50mm) micro-pitch design incorporates anti-wicking barriers for solder control. Laser-trimmed contacts ensure coplanarity within 0.08mm tolerance.Solder process features lead-free solder compatibility. The thermal mass balanced design prevents tombstoning during reflow.Accommodating 0.30mm cable thicknesses, the strain-relief system withstands 5N pull force. The graduated clamping pressure prevents cable deformation.The Flip Lock system provides positive engagement feedback. Vibration testing confirms performance to 15G RMS (10-2000Hz).Tapered interface design incorporates color-coded polarization. The chamfered entry guides facilitate blind mating operations.Copper Alloy formulation delivers stable contact resistance over temperature. The beryllium-free alloy meets EU Directive 2011/65/EU requirements.The Gold plating achieves <10m initial contact resistance. The 50 gold flash over nickel barrier prevents fretting corrosion.Liquid Crystal Polymer (LCP), Glass Filled compound provides excellent dielectric properties. The glass-reinforced structure maintains rigidity in high-temperature environments.Constructed from Polyamide (PA), Nylon, Glass Filled, the actuator mechanism withstands 10,000 cycles. The lubricant-free design prevents contamination in cleanroom applications.Solder Retention, Zero Insertion Force (ZIF) implementation includes ESD protection up to 15kV. The auto-eject mechanism prevents cable damage during disconnection.Tested at 50V with 1000V dielectric withstand. The insulated barrier design prevents arc-over in humid conditions.Qualified for -40°C ~ 85°C operation, this connector maintains mechanical stability. Thermal shock testing confirms performance from -65 C to 150 C.Meeting UL94 V-0 requirements, the material formulation produces minimal smoke density. The self-extinguishing properties exceed FAA standards.
Product Attributes
- Product Status: Active
- Flat Flex Type: FPC
- Mounting Type: Board Edge, Cutout
- Connector/Contact Type: Contacts, Bottom
- Number of Positions: 10
- Pitch: 0.020" (0.50mm)
- Termination: Solder
- FFC, FCB Thickness: 0.30mm
- Height Above Board: -
- Locking Feature: Flip Lock
- Cable End Type: Tapered
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Housing Material: Liquid Crystal Polymer (LCP), Glass Filled
- Actuator Material: Polyamide (PA), Nylon, Glass Filled
- Features: Solder Retention, Zero Insertion Force (ZIF)
- Voltage Rating: 50V
- Operating Temperature: -40°C ~ 85°C
- Material Flammability Rating: UL94 V-0
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