EW-30-13-H-D-570

Samtec Inc.'s EW-30-13-H-D-570 represents a breakthrough in Rectangular Connectors - Board Spacers, Stackers (Board to Board) technology, specifically developed for next-generation electronic systems. This advanced interconnect solution combines precision engineering with robust materials to deliver unmatched performance in demanding applications.Configurable with 60 positions, this connector family addresses diverse connectivity requirements. The scalable architecture supports everything from simple interfaces to complex backplane connections.The 0.100" (2.54mm) pitch configuration optimizes signal path lengths for improved timing margins. This spacing is particularly effective in high-speed digital circuits where signal skew must be minimized.Designed with 2 rows, this connector achieves optimal current distribution while maintaining compact dimensions. The symmetrical layout enhances thermal management and reduces hot spots.The 0.100" (2.54mm) row spacing effectively isolates differential pairs in high-speed data transmission. This critical dimension has been optimized through extensive signal integrity simulations.With 1.230" (31.242mm) overall pin length, the connector accommodates various PCB stackup configurations. The precision-machined pins ensure consistent mating depth across all positions.The 0.330" (8.382mm) mating post length has been carefully selected to provide optimal contact normal force. This dimension maintains reliable connections even under mechanical stress conditions.Featuring 0.570" (14.478mm) stack height, this solution enables flexible system packaging designs. The controlled height tolerance ensures proper alignment in multi-board assemblies.The 0.330" (8.382mm) tail length has been optimized for wave soldering processes. This dimension ensures proper solder wicking while preventing excessive thermal transfer to sensitive components.Available in Through Hole variants, the connector supports both automated and manual assembly processes. The through-hole version features reinforced solder joints for mechanical robustness.The Solder termination system has been validated for lead-free soldering processes. The solder cup design ensures reliable connections even with low-void solder pastes.Employing Gold plating, the contacts achieve excellent wear resistance over mating cycles. The proprietary finish formulation prevents fretting corrosion in dynamic applications.The 30.0µin (0.76µm) plating thickness exceeds industry standards for high-reliability applications. This specification has been verified through extensive accelerated life testing.The Black housing material incorporates UV stabilizers for long-term color retention. The high-contrast color facilitates optical inspection system recognition during automated assembly.