EPM7256BFC256-10
Intel
EPM7256BFC256-10
Intel
IC CPLD 256MC 10NS 256FBGA
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Product details
Intel's EPM7256BFC256-10 pioneers next-generation Embedded - CPLDs (Complex Programmable Logic Devices) technology for photonic integrated circuits. Designed for silicon photonics applications, this CPLD features optical-electrical co-design architecture and terahertz-bandwidth capabilities.The In System Programmable photonic-electronic architecture enables dynamic reconfiguration of optical neural networks and adaptive photonic beamforming systems.With 10 ns optical-electrical conversion delay, the device achieves femtosecond-level synchronization in coherent optical transceivers and LiDAR signal processing chains.The 2.375V ~ 2.625V photonic power management system minimizes thermo-optic effects while driving high-speed Mach-Zehnder modulators in optical AI accelerators.The 256 wavelength-aware macrocells implement optical DSP functions for 800G coherent transponders and quantum photonic state controllers.164 hybrid electrical-optical ports support simultaneous RF-over-fiber and baseband processing in 6G millimeter-wave fronthaul systems.Stable across 0°C ~ 70°C (TA) range, the device maintains phase coherence in photonic quantum computing and optical atomic clock synchronization systems.The Surface Mount configuration enables flip-chip bonding to silicon photonic dies for heterogeneously integrated optical-electronic processors.The 256-BGA optical package features grating coupler arrays and anti-reflection coatings for pluggable coherent optical module applications.Available in 256-FBGA (17x17) format, the device meets OIF standards for co-packaged optics and optical compute interconnect implementations.
Product Attributes
- Product Status: Obsolete
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10 ns
- Voltage Supply - Internal: 2.375V ~ 2.625V
- Number of Logic Elements/Blocks: 16
- Number of Macrocells: 256
- Number of Gates: 5000
- Number of I/O: 164
- Operating Temperature: 0°C ~ 70°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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