EPM570F256C4
Intel
EPM570F256C4
Intel
IC CPLD 440MC 5.4NS 256FBGA
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Product details
The EPM570F256C4 from Intel establishes new standards in Embedded - CPLDs (Complex Programmable Logic Devices) technology. Designed for harsh environment applications, this CPLD integrates radiation-hardened features with military-grade reliability.The In System Programmable capability includes tamper-resistant configuration memory, essential for secure financial transactions and government communications systems.Characterized at 5.4 ns maximum delay, the device maintains precise timing relationships in synchronous optical network (SONET) clock distribution architectures.Operating across 2.5V, 3.3V, the power management system includes brown-out detection and automatic recovery features for unmanned aerial vehicle control systems.The 440 macrocell matrix supports cascadable logic blocks, enabling scalable implementations from simple glue logic to complex protocol converters.160 I/O pins feature programmable hysteresis, improving noise immunity in electrically noisy factory automation environments.Certified for 0°C ~ 85°C (TJ) operation, the device performs reliably in downhole oil exploration tools and desert-based renewable energy installations.The Surface Mount design incorporates stress-relief features that prevent solder joint fatigue in high-vibration automotive underhood applications.The 256-BGA construction utilizes ceramic substrates for superior thermal cycling performance in power electronics and motor drive systems.Available in 256-FBGA (17x17) format, the device meets outgassing requirements for vacuum environment applications in space systems.
Product Attributes
- Product Status: Active
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.4 ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 160
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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