EPM570F256C3
Intel
EPM570F256C3
Intel
IC CPLD 440MC 5.4NS 256FBGA
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Product details
Intel's EPM570F256C3 sets new benchmarks in Embedded - CPLDs (Complex Programmable Logic Devices) technology, specifically optimized for next-generation computing architectures. Designed for reliability, this CPLD incorporates fail-safe mechanisms that exceed industry standards for error correction and fault tolerance.Utilizing In System Programmable technology, the device supports in-field firmware updates with zero downtime, particularly valuable for remote infrastructure and autonomous vehicle control systems.Precision-timed to 5.4 ns, the silicon-verified delay characteristics guarantee synchronous operation across distributed clock domains in multi-processor arrangements.The 2.5V, 3.3V power architecture incorporates advanced voltage regulation circuitry, significantly reducing power supply noise sensitivity in RF-intensive applications.The array of 440 macrocells features individual clock enable controls, allowing sophisticated power gating strategies for energy-sensitive IoT edge devices.With 160 configurable I/Os supporting LVCMOS and LVTTL standards, the device simplifies interface design in heterogeneous computing environments.Military-grade 0°C ~ 85°C (TJ) compliance ensures uninterrupted operation in extreme conditions, from desert solar installations to arctic monitoring stations.Surface Mount compatibility enables both automated assembly processes and manual rework scenarios, with lead-free finishes meeting global environmental regulations.The 256-BGA encapsulation utilizes advanced molding compounds that provide superior moisture resistance for maritime electronics and outdoor wireless infrastructure.Available in 256-FBGA (17x17) configuration, the device offers enhanced thermal cycling performance for aerospace applications subject to rapid temperature variations.
Product Attributes
- Product Status: Active
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 5.4 ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 570
- Number of Macrocells: 440
- Number of Gates: -
- Number of I/O: 160
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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