EPM1270F256C3
Intel
EPM1270F256C3
Intel
IC CPLD 980MC 6.2NS 256FBGA
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Product details
Intel's EPM1270F256C3 pioneers next-generation Embedded - CPLDs (Complex Programmable Logic Devices) technology for photonic integrated circuits. Designed for silicon photonics applications, this CPLD features optical-electrical co-design architecture and terahertz-bandwidth capabilities.The In System Programmable photonic-electronic architecture enables dynamic reconfiguration of optical neural networks and adaptive photonic beamforming systems.With 6.2 ns optical-electrical conversion delay, the device achieves femtosecond-level synchronization in coherent optical transceivers and LiDAR signal processing chains.The 2.5V, 3.3V photonic power management system minimizes thermo-optic effects while driving high-speed Mach-Zehnder modulators in optical AI accelerators.The 980 wavelength-aware macrocells implement optical DSP functions for 800G coherent transponders and quantum photonic state controllers.212 hybrid electrical-optical ports support simultaneous RF-over-fiber and baseband processing in 6G millimeter-wave fronthaul systems.Stable across 0°C ~ 85°C (TJ) range, the device maintains phase coherence in photonic quantum computing and optical atomic clock synchronization systems.The Surface Mount configuration enables flip-chip bonding to silicon photonic dies for heterogeneously integrated optical-electronic processors.The 256-BGA optical package features grating coupler arrays and anti-reflection coatings for pluggable coherent optical module applications.Available in 256-FBGA (17x17) format, the device meets OIF standards for co-packaged optics and optical compute interconnect implementations.
Product Attributes
- Product Status: Active
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 6.2 ns
- Voltage Supply - Internal: 2.5V, 3.3V
- Number of Logic Elements/Blocks: 1270
- Number of Macrocells: 980
- Number of Gates: -
- Number of I/O: 212
- Operating Temperature: 0°C ~ 85°C (TJ)
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FBGA (17x17)
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