EPF10K200SBC356-2
Altera
        
                                EPF10K200SBC356-2                            
                        
                                Altera                            
                        
                                IC FPGA 274 I/O 356BGA                            
                        Reference Price (USD)
1+
                                            $505.97000
                                        500+
                                            $500.9103
                                        1000+
                                            $495.8506
                                        1500+
                                            $490.7909
                                        2000+
                                            $485.7312
                                        2500+
                                            $480.6715
                                        Exquisite packaging
                            Discount
                            TT / Paypal / Credit Card / Western Union / Money Gram
                            Product details
                    Designed for next-generation automotive electronics, Altera's EPF10K200SBC356-2 sets new standards in Embedded - FPGAs (Field Programmable Gate Array) for reliability and performance. This radiation-hardened FPGA meets stringent automotive qualification requirements while delivering the computational power needed for autonomous driving subsystems. The architecture incorporates triple-redundant voting logic and SEU-resistant memory for functional safety applications.The 274 automotive-grade I/Os support 12V fault tolerance and include built-in current limiting. Each I/O bank can be independently configured for LIN/CAN FD/FlexRay interface protocols common in vehicle networks.Operating from 2.375V ~ 2.625V, the power architecture includes load-dump protection and reverse polarity safeguards. The adaptive body biasing technique reduces leakage current during extended vehicle standby periods.The Surface Mount package meets automotive vibration specifications while maintaining reliable connections under thermal cycling. The solder joint design has been optimized for lead-free assembly processes required in modern vehicle electronics.Qualified for 0°C ~ 70°C (TA) operation, the device maintains timing margins across the full automotive temperature range. The thermal shutdown circuitry prevents damage during extended exposure to under-hood conditions.The 356-LBGA package incorporates copper heat spreaders for efficient thermal management in confined automotive modules. The mold compound has been formulated for resistance to automotive fluids and cleaning agents.Supplied in 356-BGA (35x35) configuration, the device includes automotive-grade moisture sensitivity labeling. The tape-and-reel packaging complies with automated assembly requirements for high-volume vehicle production.                
                Product Attributes
- Product Status: Active
 - Number of LABs/CLBs: -
 - Number of Logic Elements/Cells: -
 - Total RAM Bits: -
 - Number of I/O: 274
 - Number of Gates: -
 - Voltage - Supply: 2.375V ~ 2.625V
 - Mounting Type: Surface Mount
 - Operating Temperature: 0°C ~ 70°C (TA)
 - Package / Case: 356-LBGA
 - Supplier Device Package: 356-BGA (35x35)
 

