EP4CE55F23C9LN

Optimized for industrial IoT applications, Intel's EP4CE55F23C9LN delivers unmatched performance in Embedded - FPGAs (Field Programmable Gate Array) for smart factory solutions. This FPGA combines deterministic processing with robust connectivity options, enabling real-time equipment monitoring and predictive maintenance. The architecture features built-in safety mechanisms compliant with IEC 61508 standards.Organized into 3491 safety-certified logic blocks, the architecture supports redundant processing paths. Each block includes mismatch detection circuits for fault diagnosis.Featuring 55856 hardened logic elements, this device implements safety-critical control algorithms with deterministic timing. The fault-tolerant architecture includes redundant voting logic for fail-safe operation in industrial environments.With 2396160 bits of protected memory, the FPGA buffers sensor data while maintaining data integrity. The memory subsystem implements ECC protection with configurable error thresholds for different safety integrity levels.The 324 industrial-grade I/Os support multiple fieldbus protocols including PROFINET and EtherCAT. Each I/O channel includes galvanic isolation for noise immunity in electrically noisy environments.Operating from 0.97V ~ 1.03V, the power architecture includes surge protection for industrial power line disturbances. The adaptive power management system optimizes energy consumption based on processing load.The Surface Mount package meets IP67 protection requirements for harsh industrial environments. The conformal coating option provides additional protection against chemical exposure.Rated for 0°C ~ 85°C (TJ) operation, the device maintains reliable performance in foundry and manufacturing settings. The thermal overload protection prevents damage during extreme ambient conditions.The 484-BGA package incorporates vibration-resistant mounting features for heavy machinery applications. The robust construction withstands mechanical shock common in industrial automation.Supplied in 484-FBGA (23x23) configuration, the device includes industrial temperature range certification. The packaging meets requirements for automated assembly in high-volume production.